Title:
フィラメント３次元結合体製造装置およびフィラメント３次元結合体の製造方法
Document Type and Number:
Japanese Patent JP6527602
Kind Code:
B2
Abstract:
In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonded member.
Inventors:
Masakazu Kojima
Masashi Fuchigami
Naritaka Makino
Akira Mizuno
Masashi Fuchigami
Naritaka Makino
Akira Mizuno
Application Number:
JP2017560032A
Publication Date:
June 05, 2019
Filing Date:
September 14, 2016
Export Citation:
Assignee:
Airweave Co., Ltd.
International Classes:
D04H3/07; B29C67/00; B33Y10/00; B33Y30/00; B33Y50/02; D04H3/033
Domestic Patent References:
| JP11350326A | ||||
| JP2016000528A |
Foreign References:
| WO2012035736A1 | ||||
| US5464491 |
Attorney, Agent or Firm:
Hideo Yamamoto