METAL FILM FORMATION DEVICE

Japanese Patent JP2017088918

A

PROBLEM TO BE SOLVED: To provide a metal film formation device where the leakage of a metal solution from a solution chamber is suppressed, and, with a simple device constitution, a metal film is formed while uniformly contacting the surface of a base material with a solid electrolytic membrane.SOLUTION: Provided is a film formation device 1 at least comprising: an anode 11; a solid electrolytic membrane 13 arranged between the anode 11 and a base material B; a solution chamber 15 arranged between the anode 11 and the solid electrolytic membrane 13 and storing a metal solution; and a power source part 16 of applying voltage to a space between the anode 11 and the base material B. The solution chamber 15 is formed of: a housing 12 including an opening part 12a having a storage space S storing a metal solution L and having an opening part 12a in which the storage space S is released to the base material side; and an elastic body 14 fitted to the opening part 12a of the housing 12, the solid electrolytic membrane 13 is fitted to the solution chamber 15 via the elastic body 14. The elastic body 14 stretches to the outside of the solution chamber 15 along the pressing direction in such a manner that, when the solid electrolytic membrane 13 is pressed against the base material B, compressive deformation is possible to the pressing direction of the base material B.SELECTED DRAWING: Figure 1

SATO YUKI
HIRAOKA MOTOKI
YANAGIMOTO HIROSHI

JP2015216926A

May 25, 2017

November 04, 2015

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TOYOTA MOTOR CORP

C25D17/00

JP2002327297A	2002-11-15
JP2015145526A	2015-08-13

WO2015072481A1

2015-05-21

Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima

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