Title:
組成物及びこれを用いて得られる膜
Document Type and Number:
Japanese Patent JP6516595
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composition excellent in conformal film formation to a fine recess such as a wiring of a semiconductor or a concave-convex shape such as three dimensional wiring pattern and excellent in low temperature burning, insulation property and embedding property depending on applications.SOLUTION: There is provided a composition containing metal alkoxide represented by the following general formula (A) and a silicon compound having an isocyanate group represented by the following general formula (B). R-M(OR)(A), where M is m valent metal, Ris a hydrogen atom or a monovalent organic group, Ris a monovalent organic group and p is an integer of 1 to m. R-Si(NCO)(B), where Ris a hydrogen atom or a monovalent hydrocarbon group and n is 2 to 4.SELECTED DRAWING: Figure 1
Inventors:
Yoshihiro Sawada
Application Number:
JP2015132820A
Publication Date:
May 22, 2019
Filing Date:
July 01, 2015
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08G18/77; C08G79/00; C09D175/00; H01L21/027
Domestic Patent References:
| JP200786711A |
Attorney, Agent or Firm:
Masayuki Masabayashi