Title:
A fine pattern formation method and the covering agent for the formation of pattern detailed
Document Type and Number:
Japanese Patent JP5916391
Kind Code:
B2
Abstract:
A method for forming a fine pattern, including forming a resist film by applying, on a substrate, a resist composition containing a base material having a solubility, in a developer liquid including an organic solvent, that decreases according to an action of an acid, a compound which generates an acid upon irradiation, and an organic solvent; exposing the resist film; forming a resist pattern using the developer liquid; applying, on the resist pattern, a coating agent for pattern fining including a resin and an organic solvent; and heating the resist pattern on which a coating film is formed.
Inventors:
Namiki Takumi
Yuriko Shirai
Sugawara Mai
Yuriko Shirai
Sugawara Mai
Application Number:
JP2012005227A
Publication Date:
May 11, 2016
Filing Date:
January 13, 2012
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/40; G03F7/038; G03F7/039; G03F7/32; H01L21/027
Domestic Patent References:
| JP2008310314A | ||||
| JP2013064829A | ||||
| JP2013097295A |
Foreign References:
| WO2013061601A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi