Title:
Flexible printed circuit board mounting package and its manufacturing method
Document Type and Number:
Japanese Patent JP6317226
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent peeling or destruction of solder at a fixing portion of the multilayer ceramic substrate of a flexible substrate mounting package and an FPC.SOLUTION: In a flexible printed circuit board mounting package where a multilayer substrate, formed in an optical transmission and reception module and having a first electrode on the upper surface, and a flexible printed circuit board, having a second electrode on the lower surface, are connected by solder, a hole communicating with at least one of a part of the multilayer substrate layer and the first electrode, or the flexible printed circuit board and the second electrode, is bored. The hole bored in a part of the multilayer substrate layer and the first electrode does not penetrate the multilayer substrate.SELECTED DRAWING: Figure 8
Inventors:
Kanazawa
Tetsuichiro Ohno
Tetsuichiro Ohno
Application Number:
JP2014207312A
Publication Date:
April 25, 2018
Filing Date:
October 08, 2014
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H05K1/11; H05K1/14
Domestic Patent References:
| JP9245856A | ||||
| JP2002368370A | ||||
| JP2012014206A | ||||
| JP61190169U |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office
Previous Patent: Magnetic powder for magnetic recording media
Next Patent: TRANSFER SPEED CONTROLLING DEVICE IN GLASS ANNEALING EQUIPMENT
Next Patent: TRANSFER SPEED CONTROLLING DEVICE IN GLASS ANNEALING EQUIPMENT