Title:
A fluororesin content heat hardening resin constituent and its hardened material
Document Type and Number:
Japanese Patent JP6283441
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an adhesive composition for a circuit board, which is low in relative dielectric constant and dielectric dissipation factor, and superior in adhesiveness, heat resistance, dimensional stability and flame retardancy, and which is to be used for fabrication of a circuit board; and a laminate board for a circuit board, a coverlay film and a prepreg, which are each arranged by use of the adhesive composition.SOLUTION: An adhesive composition for a circuit board comprises: a nonaqueous dispersion (material) including fluorine-based resin micro powder, a compound of the formula (I) of 0.1-15 mass% to the fluorine-based resin micro powder, and 8000 ppm or less of a water content; and a resin composition including a cyanate ester resin and/or an epoxy resin.SELECTED DRAWING: None
Inventors:
Atsushi Sato
Hiroshi Abe
Masashi Sakagami
Takanori Suzuki
Hiroshi Abe
Masashi Sakagami
Takanori Suzuki
Application Number:
JP2017082148A
Publication Date:
February 21, 2018
Filing Date:
April 18, 2017
Export Citation:
Assignee:
MITSUBISHI PENCIL CO.,LTD.
International Classes:
C08L79/04; C08L27/12; C08L29/14; C08L63/00; C09J11/08; C09J163/00; C09J179/04; C09J201/02; H05K3/38
Domestic Patent References:
| JP56099347A | ||||
| JP57165848A | ||||
| JP57201240A | ||||
| JP61129655A |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba