Title:
FLUX COMPOSITION AND SOLDER PASTE
Document Type and Number:
Japanese Patent JP2018051614
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flux composition and a solder paste which suppress lowering of viscosity of a flux composition in heating and thereby suppresses occurrence of an oxide film on the outermost surface of a fillet portion, and thereby can easily discharge voids generated from below a chip from the fillet portion even when a solder alloy containing such a composition as to easily generate voids such as Ni is used.SOLUTION: A flux composition contains a base resin, an activator, a solvent and an inorganic filler, where the inorganic filler contains hydrophobic fumed silica, and a blending amount of the inorganic filler is 0.1 mass% to 5 mass% with respect to the total amount of the flux composition.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
HORI ATSUSHI
NAKANO KEN
KATSUYAMA TSUKASA
ARAI MASAYA
MUNEKAWA YURIKA
MARUYAMA DAISUKE
NAKANO KEN
KATSUYAMA TSUKASA
ARAI MASAYA
MUNEKAWA YURIKA
MARUYAMA DAISUKE
Application Number:
JP2016193135A
Publication Date:
April 05, 2018
Filing Date:
September 30, 2016
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
| JPH05337685A | 1993-12-21 | |||
| JP2003264367A | 2003-09-19 | |||
| JP2001150184A | 2001-06-05 | |||
| JP2014028391A | 2014-02-13 |
Attorney, Agent or Firm:
Yoko Ota
Previous Patent: 電池の診断方法、電池の診断プログラム、電池管理装置、及び蓄電システ...
Next Patent: A heat forge public-funds type and a hot forging method
Next Patent: A heat forge public-funds type and a hot forging method