Title:
The flux for sudden heating construction methods, and the solder paste for sudden heating construction methods
Document Type and Number:
Japanese Patent JP6160608
Kind Code:
B2
Abstract:
The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a glycol-ether-based solvent, an organic acid, and a thixotropic agent, wherein the solvent is a glycol-based solvent having a low boiling point that is not more than 200 degrees C, content of the solvent having the low boiling point is not less than 20 weight % to not more than 40 weight %. The solder paste is obtained by mixing this flux with solder alloy powder. When the solvent having a high boiling point that is more than 200 degrees C is further contained, the solvent having the low boiling point of not less than 60 weight % in relation to the whole of the solvent is contained.
Inventors:
Kakuishi Mamoru
Kazuhiro Minegishi
Kazuhiro Minegishi
Application Number:
JP2014265959A
Publication Date:
July 12, 2017
Filing Date:
December 26, 2014
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/363
Domestic Patent References:
| JP7290277A | ||||
| JP1148488A | ||||
| JP8332592A | ||||
| JP2009542019A | ||||
| JP592296A |
Foreign References:
| US6217671 |
Attorney, Agent or Firm:
Yamaguchi International Patent Office