Title:
A formation method of a chip with a glue film
Document Type and Number:
Japanese Patent JP6004705
Kind Code:
B2
Abstract:
The method involves attaching an adhesive film to a rear of a wafer (W) after performing a separation start dot-forming step. Multiple separation grooves in the adhesive film along the separation line are formed by applying a laser beam or by using a cutting blade. The film is attached to an extension of the adhesive film attached on the wafer. The sheet is expanded by applying an external force to the wafer. The wafer is separated from the adhesive film to obtain individual chips such that each chip is mounted on a rear side adhesive film.
Inventors:
Karl Priwassa
Application Number:
JP2012083780A
Publication Date:
October 12, 2016
Filing Date:
April 02, 2012
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/304; H01L21/52
Domestic Patent References:
| JP2006086509A | ||||
| JP2009283925A | ||||
| JP2011049431A | ||||
| JP2005001001A | ||||
| JP2008028325A | ||||
| JP2005332982A | ||||
| JP2007005530A | ||||
| JP2011109007A |
Attorney, Agent or Firm:
Akira Matsumoto
Hiroshi Oue
Hiroshi Oue
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