Title:
電磁波遮蔽層の製造時に無電解メッキに対する触媒前駆体樹脂組成物、これを用いた金属パターンの形成方法及びこれにより製造された金属パターン
Document Type and Number:
Japanese Patent JP2010530441
Kind Code:
A
Abstract:
A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.
Inventors:
Kim, Min Kyung
Ko, Min Jin
Lee, Saint-Chur
Rho, John Im
Ko, Min Jin
Lee, Saint-Chur
Rho, John Im
Application Number:
JP2010508305A
Publication Date:
September 09, 2010
Filing Date:
May 15, 2008
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08F222/06; C08F2/44; C08F212/14; C08F220/04; C08F228/06; C08F232/04; C08F236/14; C08F291/06; C08J7/04; C08L33/24; C23C18/30; G03F7/004; G03F7/027; G03F7/033; G03F7/40; H01L21/027; H05K3/18
Domestic Patent References:
| JP2006510809A | 2006-03-30 | |||
| JP2006510809A | 2006-03-30 | |||
| JP2009533521A | 2009-09-17 | |||
| JPH0850356A | 1996-02-20 | |||
| JP2004221564A | 2004-08-05 | |||
| JPH10163673A | 1998-06-19 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation