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Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE FILM, METHOD FOR FORMING RESIST PATTERN AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2018045077
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent heat resistance and a low coefficient of thermal expansion, and achieving good resolution, electric reliability (HAST durability), and elimination of a filler residue, and provide a photosensitive film using the above composition, a method for forming a resist pattern, and a printed wiring board.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable monomer having an ethylenically unsaturated bond, (C) a photopolymerization initiator, and (D) an inorganic filler. The acid-modified vinyl group-containing epoxy resin of the component (A) comprises a compound represented by a novolac epoxy resin (general formula (1)) or a bisphenol type novolac resin (general formula (2)), where a dispersion degree represented by Mw/Mn ((weight average molecular weight)/(number average molecular weight)) is 2.0 to 5.0; and the content of the (D) inorganic filler is 30 to 70 mass% with respect to the whole solid content.SELECTED DRAWING: None

Inventors:
KOJIMA MASAYUKI
KOMURO NOBUHITO
IRISAWA SHINJI
DAISHIMA YUTA
Application Number:
JP2016179479A
Publication Date:
March 22, 2018
Filing Date:
September 14, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/027; C08G59/20; G03F7/004; H05K3/28
Domestic Patent References:
JP2002121258A2002-04-23
JP2013218146A2013-10-24
Foreign References:
WO2014136897A12014-09-12