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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY OBTAINED FROM THE SAME
Document Type and Number:
Japanese Patent JP2017165928
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molded body which is excellent in surface smoothness at the time of molding and maintains mechanical strength and heat resistance.SOLUTION: There is provided a 4-methyl-1-pentene-copolymer composition which contains 1-50 pts.mass of a 4-methyl-1-pentene copolymer (C) satisfying a specific requirement with respect to 10-90 pts.mass of a 4-methyl-1-pentene copolymer (A) satisfying a specific requirement and 90-10 pts.mass of a propylene polymer (B) (where the total of (A) and (B) is 100 pts.mass).SELECTED DRAWING: None

Inventors:
UEKUSA TAKAYUKI
TAMO KATSUMASA
FUJIWARA KAZUTOSHI
Application Number:
JP2016055293A
Publication Date:
September 21, 2017
Filing Date:
March 18, 2016
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L23/20; C08J5/18; C08L23/10
Domestic Patent References:
JP2012201392A2012-10-22
JP2013216817A2013-10-24
JP2004238469A2004-08-26
JP2002348726A2002-12-04
Foreign References:
WO2013099876A12013-07-04