MOLDED BODY AND MANUFACTURING METHOD THEREFOR

Japanese Patent JP2017066239

A

PROBLEM TO BE SOLVED: To provide a molded body excellent in dimensional stability and a manufacturing method therefor.SOLUTION: A molded body according to an aspect contains a polymer with melting peak temperature of 180°C to 260°C as a main component and has a dimensional change rate before and after a heating treatment by maintaining at 180°C for 90 seconds, increasing the temperature to 270°C for 30 seconds, maintaining at 270°C for 30 seconds and decreasing the temperature to 180°C for 90 seconds of 1% or less and mass change rate before and after standing at 25°C and relative humidity of 40% for 2 weeks. The polymer is preferably crosslinked. Preferably the polymer has no aromatic ring and a ketone structure in a main chain. The polymer is preferably a copolymer of a carbon monooxide and olefin, especially the polymer is preferably an alternating copolymer of hydrocarbon and olefin. Storage elastic modulus of the molded body at 300°C is preferably 1 MPa or more. The molded body preferably further contains ultrahigh-molecular weight polyethylene and a fluorine resin.SELECTED DRAWING: None

JPH10166493	FILM SHEET
JPH02263830	HIGHLY HEAT-RESISTANT POLYARYLENE SULFIDE
JP2009084506	PELLET, AND FILM FORMED OF THE SAME

YAMAZAKI SATOSHI
NISHIKAWA SHINYA
OKABE SHOHEI
KATAYAMA KOJI

JP2015191773A

April 06, 2017

September 29, 2015

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SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC FINE POLYMER INC

C08J7/00; C08L73/00

JP2000501761A	2000-02-15
JP2001200154A	2001-07-24
JP2013166926A	2013-08-29
JPH11116623A	1999-04-27
JPS4714015B1
JPH02253924A	1990-10-12
JP2001525228A	2001-12-11

WO2008032679A1

2008-03-20

Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka

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