Title:
研削装置及び研削方法
Document Type and Number:
Japanese Patent JP5107733
Kind Code:
B2
Abstract:
A grinding device including a multi-wheel grindstone and an electrode arranged opposite to a grinding action surface of the multi-wheel grindstone with an interval, in which a work is ground and machined while the grinding action surface of the multi-wheel grindstone is electrolytic-dressed by supplying conductive machining fluid between an electrode action surface of the electrode and the grinding action surface of the multi-wheel grindstone, and applying a voltage between the multi-wheel grindstone and the electrode, wherein the electrode has a laminate body in which electrode plates whose electrode action surfaces are arranged so as to oppose the grinding action surface of each of the grinding wheels are alternately sandwiched by a plurality of insulating plates; and a flow passage for distributing the machining fluid supplied to between the grinding action surface and the electrode action surface is formed at the electrode plate and the insulating plate.
Inventors:
Oricardo Ichiro
Application Number:
JP2008012723A
Publication Date:
December 26, 2012
Filing Date:
January 23, 2008
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
B24B53/00
Domestic Patent References:
| JP8108427A | ||||
| JP10225865A | ||||
| JP7001342A | ||||
| JP9057622A | ||||
| JP2005046805A | ||||
| JP11262860A | ||||
| JP3086472A | ||||
| JP7037562U | ||||
| JP7033554U | ||||
| JP5285830A |
Attorney, Agent or Firm:
Kenzo Matsuura