Title:
研削方法および研削盤
Document Type and Number:
Japanese Patent JP5573459
Kind Code:
B2
Abstract:
A core grinding wheel that has a grinding layer (72) on an outer periphery of a core (71) is used. An ultrasonic wave is output from an ultrasonic sensor (14) to the grinding layer (72) via grinding fluid (20). An ultrasonic measuring device control unit (34) calculates a thickness of the grinding layer (72) on the basis of a sonic velocity in the grinding layer (72) and an arrival time difference between a reflected wave from a surface of the grinding layer (72) and a reflected wave from a surface of the outer periphery of the core (71). A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel (7), which is calculated on the basis of the measured thickness of the grinding layer (72) and an outside diameter of the core (71).
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Inventors:
Makoto Tano
Wakazono 賀 student
Wakazono 賀 student
Application Number:
JP2010168011A
Publication Date:
August 20, 2014
Filing Date:
July 27, 2010
Export Citation:
Assignee:
JTEKT Corp.
International Classes:
B24B49/10; B24B5/04; B24B53/00