Title:
パッケージ基板の研削方法
Document Type and Number:
Japanese Patent JP6495054
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable a chuck to securely suck and hold a plate-like work without exchanging chuck tables in accordance with kinds of plate-like works.SOLUTION: Since this invention comprises a placement step for placing a package substrate 1 on the holding face 140 of a chuck table 14, a holding face sealing step for covering the outer peripheral edge 3c of an electrode plate 3 with a sheet 5 having an opening 5a smaller than the electrode plate 3 and larger than a resin sealing layer 2 so that the resin sealing layer 2 may be exposed, and a holding step for making the holding face 140 of the chuck table 14 suck and hold the sheet 5 and the package substrate 1, a plate-like work can securely be sucked and held by the exchanging chuck tables 14 without exchanging the chuck tables 14 in accordance with kinds of plate-like works.SELECTED DRAWING: Figure 5
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Inventors:
Yuu Shun
Keisuke Suzuki
Keisuke Suzuki
Application Number:
JP2015042290A
Publication Date:
April 03, 2019
Filing Date:
March 04, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B7/30; B24B41/06
Domestic Patent References:
| JP2009061568A | ||||
| JP2004283962A | ||||
| JP2007203403A | ||||
| JP2011181641A | ||||
| JP2011192781A | ||||
| JP2013093383A | ||||
| JP2008187098A | ||||
| JP2012039039A |
Foreign References:
| US20040206304 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
Kyoko Kawamura
Isao Sasaki
Ken Kubo
Kyoko Kawamura
Isao Sasaki
Ken Kubo