Title:
The grinding method of a semiconductor wafer, and the zipper table for semiconductor wafer maintenance
Document Type and Number:
Japanese Patent JP5997028
Kind Code:
B2
Inventors:
Yusuke Fukuda
Application Number:
JP2012267710A
Publication Date:
September 21, 2016
Filing Date:
December 06, 2012
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L21/304; B24B53/00; H01L21/301
Domestic Patent References:
| JP11163103A | ||||
| JP7078864A | ||||
| JP2009239195A | ||||
| JP2010052052A | ||||
| JP2007288077A | ||||
| JP2010129623A | ||||
| JP2012121096A |
Attorney, Agent or Firm:
Seigo Matsuo