Title:
A group III nitride compound board, a manufacturing method for the same, a lamination group III nitride compound board, a group III nitride semiconductor device, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6248395
Kind Code:
B2
Inventors:
Keiji Ishibashi
Akihiro Yasato
Naoki Matsumoto
Fumitake Nakanishi
Akihiro Yasato
Naoki Matsumoto
Fumitake Nakanishi
Application Number:
JP2013029114A
Publication Date:
December 20, 2017
Filing Date:
February 18, 2013
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/02; H01L21/20; H01L21/338; H01L29/778; H01L29/812; H01L33/32
Domestic Patent References:
| JP2010182936A | ||||
| JP2010269970A | ||||
| JP2012230969A |
Foreign References:
| WO2013021902A1 |
Attorney, Agent or Firm:
Fukami patent office