Title:
A hardenability epoxy resin constituent, its hardened material, and an optical semiconductor device
Document Type and Number:
Japanese Patent JP6185703
Kind Code:
B2
Inventors:
Takenaka Hiroto
Application Number:
JP2012231749A
Publication Date:
August 23, 2017
Filing Date:
October 19, 2012
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C08L63/00; C08G59/22; C08K3/36; C08K9/04; C08L33/06; H01L23/29; H01L23/31
Foreign References:
| WO2008153125A1 | ||||
| WO2012086463A1 | ||||
| WO2012093591A1 | ||||
| WO2010013407A1 | ||||
| WO2010098285A1 |
Attorney, Agent or Firm:
Yukihisa Goto
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