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Title:
硬化性シリコーン組成物およびその硬化物
Document Type and Number:
Japanese Patent JP4799848
Kind Code:
B2
Abstract:
A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≰a≰0.8; on average, “b” satisfies the following condition: 0.2≰b≰0.8; and, on average, “c” satisfies the following condition: 0.2

Inventors:
Yoshitsugu Morita
Isshiki
Hiroshi Ueki
Atsushi Togashi
Application Number:
JP2004322805A
Publication Date:
October 26, 2011
Filing Date:
November 05, 2004
Export Citation:
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Assignee:
DOW CORNING CORPORATION
International Classes:
C08G59/20; C08K3/00; C08G59/62; C08L63/00; C08L83/06; C09D183/06; C09J163/00; C09J183/06
Domestic Patent References:
JP6298897A
JP6306084A
JP10212395A