Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2017125102
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition that is excellent in the leveling of a coating film surface as well as a pattern shape while securing phosphorescence, a dry film having a resin layer obtained from the composition, a cured product thereof, and a printed wiring board having the cured product.SOLUTION: A curable resin composition comprises (A) curable resin, (B) photoexcitable inorganic filler, and (C) inorganic nanoparticles, excluding titanium oxide, with an average primary particle diameter of 20 nm or more and 1000 nm or less. There are also provided a dry film, a cured product and a printed wiring board prepared therewith.SELECTED DRAWING: None
Inventors:
SHIMAMIYA AYUMI
Application Number:
JP2016003961A
Publication Date:
July 20, 2017
Filing Date:
January 12, 2016
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
C08L101/00; C08J7/04; C08K3/00; H05K3/28
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
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