Title:
Curable resin composition, cured product, electrical / electronic parts and circuit board material
Document Type and Number:
Japanese Patent JP6307236
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which has good dielectric characteristics, e.g. a low dielectric constant and a low dielectric tangent, even after severe thermal hysteresis, gives a hardened product having high adhesion reliability and is usable as a dielectric material, an insulation material and a heat-resistant material in fields, e.g. electrical and electronic industries and space and aviation industries and its production method and hardened product.SOLUTION: A curable resin composition comprises (A) a poly(vinylbenzyl) ether compound having vinyl benzyl ether groups and obtained by reacting a naphthol aralkyl resin with a vinyl aromatic halomethyl compound, (B) a cyanate resin and (C) a metal hardening catalyst.
Inventors:
Kawabe Honest
Niranjan Kumar Suresta
Yuko Hotta
Niranjan Kumar Suresta
Yuko Hotta
Application Number:
JP2013204373A
Publication Date:
April 04, 2018
Filing Date:
September 30, 2013
Export Citation:
Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
C08L79/04; B32B15/08; C08K5/56; C08L61/14; C09D161/14; C09D179/04; H05K1/03
Domestic Patent References:
| JP2010138364A | ||||
| JP2003306591A | ||||
| JP2004331774A | ||||
| JP2010285594A | ||||
| JP2015030776A | ||||
| JP2015189926A | ||||
| JP2015067797A | ||||
| JP4591946B2 | ||||
| JP1503238A | ||||
| JP4465257B2 | ||||
| JP2004323730A |
Foreign References:
| WO2010082658A1 | ||||
| US20090203279 | ||||
| US20020197479 | ||||
| WO2014103926A1 |
Attorney, Agent or Firm:
Kazuya Sasaki
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
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