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Title:
A hardening resin constituent, and the printed wired board and light reflector using it
Document Type and Number:
Japanese Patent JP6078595
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition having a high reflectance and excellent light-diffusing property in a cured product while suppressing degradation by light, and a printed wiring board and a reflector having a solder resist formed by using the above composition.SOLUTION: The curable resin composition for diffusion comprises: a photosensitive carboxyl group-containing resin obtained by allowing a carboxyl group-containing (meth)acrylic copolymer resin to react with a compound having an oxirane ring and an ethylenically unsaturated group in one molecule; a photopolymerization initiator; a photopolymerizable monomer; titanium oxide surface-treated with silica and alumina; an organic solvent; and at least one of barium sulfate and talc. The compounding amount of the at least one of barium sulfate and talc is 1 to 100 pts.mass with respect to 100 pts.mass of the carboxyl group-containing resin.

Inventors:
Asami Nosaka
Hima Seichi
Shigeru Ushiki
Application Number:
JP2015147989A
Publication Date:
February 08, 2017
Filing Date:
July 27, 2015
Export Citation:
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Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08F290/12; G03F7/004; C08G59/42; C08K3/30; C08K3/34; C08K9/02; C08L33/00; G03F7/038; H05K3/28
Domestic Patent References:
JP2008211036A
JP2007249148A
JP2010160471A
JP2007322546A
JP2008257044A
JP2009194222A
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro