Title:
A heat flux sensor module and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6256536
Kind Code:
B2
Abstract:
A heat flux sensor module 2 includes: a first film 20 including a first surface 21; a plurality of sensor chips 10 which are disposed spaced apart from each other on the first surface 21 and detect heat flux; a second film 30 stacked on the first surface 21 of the first film 20 so that the plurality of sensor chips 10 are sandwiched between the first film 20 and the second film 30; and a heat conducting member 40 which is disposed between adjacent sensor chips 10 and has higher heat conductivity than air. The heat conducting member 40 is in contact with both the first film 20 and the second film 30.
Inventors:
Toshikazu Harada
Atsushi Sakata
Toshihisa Taniguchi
Riko Goko
Keiji Okamoto
Atsushi Sakata
Toshihisa Taniguchi
Riko Goko
Keiji Okamoto
Application Number:
JP2016132563A
Publication Date:
January 10, 2018
Filing Date:
July 04, 2016
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01K17/20; G01K7/02
Domestic Patent References:
| JP2016011950A | ||||
| JP2014007376A | ||||
| JP4115581A |
Foreign References:
| US20120261402 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office
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