A heat relay, a heat switch, a heating cooling device, a heat cycle injection-molding device, and a heat cycle injection molding method - Japan Aviation Electronics Industry Co., Ltd.

Title:

A heat relay, a heat switch, a heating cooling device, a heat cycle injection-molding device, and a heat cycle injection molding method

Document Type and Number:

Japanese Patent JP6114790

Kind Code:

B2

More Like This:

WO/2021/255176	HEAT PIPE, SYSTEM AND METHOD FOR SWITCHING AND/OR PROGRAMMING A TRANSPORT OF HEAT
JP2018159534	HEAT PIPE HEAT EXCHANGER

Inventors:

Fukuda Takuma

Application Number:

JP2015165690A

Publication Date:

April 12, 2017

Filing Date:

August 25, 2015

Export Citation:

Assignee:

Japan Aviation Electronics Industry Co., Ltd.

International Classes:

F28D15/02; B29C45/73; B29C45/78

Domestic Patent References:

Foreign References:

US5771967

Attorney, Agent or Firm:

Naoki Nakao
Yukio Nakamura
Yoshimura Munehiro

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