Title:
The heat-resistant SAN resin composition containing heat-resistant SAN resin, its manufacturing method, and it
Document Type and Number:
Japanese Patent JP6211706
Kind Code:
B2
Abstract:
Disclosed are a heat-resistant SAN resin, a method of producing the same and a heat-resistant SAN resin composition comprising the same. More specifically, disclosed are a heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, a method of producing the same and a heat-resistant SAN resin composition comprising the same. Advantageously, provided are a heat-resistant SAN resin with maintained heat resistance, improved polymerization conversion rate and increased weight average molecular weight, a method of producing the same, and a heat-resistant SAN resin composition containing the same with excellent chemical resistance, superior mechanical properties and good balance between properties.
Inventors:
Kang, Byung-il
Choi, Eun-Jung
Song, Taun
Han, Chang-Hun
Choi, Eun-Jung
Song, Taun
Han, Chang-Hun
Application Number:
JP2016541515A
Publication Date:
October 11, 2017
Filing Date:
December 14, 2015
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08F212/10; C08F212/06; C08F220/28; C08L25/12; C08L55/02
Domestic Patent References:
| JP2005002316A | ||||
| JP10025422A | ||||
| JP7001629A | ||||
| JP6329852A | ||||
| JP2005220344A | ||||
| JP6001883A | ||||
| JP10168131A | ||||
| JP6293849A |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners
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