A heat-resistant styrene system resin composition, its manufacturing method, and the forming object using this

Title:

A heat-resistant styrene system resin composition, its manufacturing method, and the forming object using this

Document Type and Number:

Japanese Patent JP6273923

Kind Code:

B2

Inventors:

Keiichi Uchida
Daigo Nonokawa
Go Fukukita

Application Number:

JP2014047522A

Publication Date:

February 07, 2018

Filing Date:

March 11, 2014

Export Citation:

Assignee:

DIC Corporation

International Classes:

C08L33/02; C08J9/12; C08L55/00

Domestic Patent References:

Attorney, Agent or Firm:

Kono Tsuyo

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