Title:
HEAT SINK, HEAT DISSIPATION STRUCTURE, COOLING STRUCTURE AND DEVICE
Document Type and Number:
Japanese Patent JP2016178208
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat sink, a heat dissipation structure, a cooling structure and a device, in which a temperature rise in a heat sink on a leeward side can be minimized without increasing cost.SOLUTION: A heat sink 140 includes a plurality of regions (a first heat sink 141, a second heat sink 142 and a third heat sink 143) along a blowing direction A of air blown from an air blowing section 150. The heat sink 140 is configured such that thermal resistances of the plurality of regions become lower toward a leeward side in the blowing direction A of the air blowing section 150.SELECTED DRAWING: Figure 1
Inventors:
MITSUI TOMOYUKI
Application Number:
JP2015057403A
Publication Date:
October 06, 2016
Filing Date:
March 20, 2015
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/36; H01L23/467; H05K7/20
Domestic Patent References:
| JP2003188321A | 2003-07-04 | |||
| JP2001024122A | 2001-01-26 | |||
| JPS57201846U | 1982-12-22 | |||
| JP2002314278A | 2002-10-25 | |||
| JPS61129349U | 1986-08-13 | |||
| JP2010040188A | 2010-02-18 | |||
| JP2014117011A | 2014-06-26 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka