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Title:
A heat supply control device, a heat distribution system, and a heat supply control method
Document Type and Number:
Japanese Patent JP6033674
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat supply system and a method for reducing the total power consumption of a pump of each supply plant, in a system constituted of a plurality of plants and a plurality of customers.SOLUTION: The number of revolutions at which the power consumption of the pump of each heat supply plant becomes minimum is calculated by using a primary-side necessary flow rate of a heat exchanger of each customer building, a pressure loss equitation, a pump lift curve equitation, and a flow-rate preservation formula, the pump whose increase amount of the power consumption is small with respect to an increase of the number of revolutions is controlled according to a valve opening of the customer building, the pump of the other heat supply plant is controlled with the calculated number of revolutions as a target value, and heat supply is performed.

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Inventors:
Nakano Michiki
Yasuko Shiga
Takahari Ishida
Minnori Tomita
Application Number:
JP2012286633A
Publication Date:
November 30, 2016
Filing Date:
December 28, 2012
Export Citation:
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Assignee:
Hitachi Industrial Control Solutions Co., Ltd.
International Classes:
F24F11/02; F24F5/00
Domestic Patent References:
JP2011127859A
JP2009243718A
Attorney, Agent or Firm:
Manabu Inoue



 
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