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Patent Searching and Data


Title:
特にはんだ接続に用いられる熱処理方法及び熱処理装置
Document Type and Number:
Japanese Patent JP5159768
Kind Code:
B2
Abstract:
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).

Inventors:
Stefan Veber
Application Number:
JP2009512402A
Publication Date:
March 13, 2013
Filing Date:
April 27, 2007
Export Citation:
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Assignee:
Pink Gezel Shaft Mitt Beschlenktor Haftung Thermo System
International Classes:
B23K1/008; B23K3/08; B23K31/02; F27B17/00; F27D5/00; F27D7/06; F27D9/00; H05K3/34
Domestic Patent References:
JP4171888A
JP62148085A
JP2003517376A
JP5050218A
JP6164132A
JP4270064A
JP5154649A
Attorney, Agent or Firm:
Koichi Miyagawa