Title:
【発明の名称】金属ボールの熱処理方法および装置
Document Type and Number:
Japanese Patent JP2904122
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the unevenness of thickness of a solder coated layer of a metallic ball and to discharge the occluded gas in the coated layer. SOLUTION: On a recessed part 3 having gas supplying hole 4 formed at the bottom surface in the recessing part 2 of a plate, the metallic ball 8 formed by applying an electrical conductive material having lower m.p. than that of a metallic core on the metallic core, is arranged. Successively, a cover plate 9 is lowered to cover the metallic ball 8 from the upper part and also, a prescribed space is formed with the recessed part 3 and a recessed part 10 formed in the cover plate 9. The heat treatment is applied to the metallic ball 8 while turning the metallic ball 8 in the prescribed space by feeding the gas heated at a temp. higher than the m.p. of the electrical conductive material into the space from a gas supplying hole 4.
Inventors:
KIMURA TAKEHIRO
Application Number:
JP13858596A
Publication Date:
June 14, 1999
Filing Date:
May 31, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B22F1/00; C21D9/36; H01L23/12; H01R4/02; H05K1/14; H05K3/36; C22F1/00; H05K3/34; (IPC1-7): B22F1/00; C21D9/36; C22F1/00; H01L23/12; H01R4/02; H05K1/14; H05K3/36
Domestic Patent References:
| JP799385A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)