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Title:
多層リソグラフィプロセス用の高エッチング耐性下層組成物
Document Type and Number:
Japanese Patent JP2010519594
Kind Code:
A
Abstract:
An etch resistant thermally curable Underlayer for use in a multiplayer liyhographic process to produce a photolithographic bilayer coated substrate, the composition having: (a) at least one cycloolefin polymer comprising at least one repeating unit of Structure (I), and at least one repeating unit of Structure (II), and optionally at least one repeating unit of Structure (III) with the proviso that neither Structure (I) nor Structure (II) nor Structure (III) contains acid sensitive groups. b) at least one cross-linking agent selected from the group consisting of an amino or phenolic cross-linking agent; c) a least one thermal acid generator (TAG); d) at lest one solvent; and e) optionally, at least one surfactant.

Inventors:
De, Vinodo Bee.
Malik, Sanjay
Sakamuri and Raju
Hong, Chisun
Application Number:
JP2009551006A
Publication Date:
June 03, 2010
Filing Date:
February 21, 2008
Export Citation:
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Assignee:
FujiFilm Electronic Materials USA, Inc.
International Classes:
G03F7/11; C08F232/08; G03F7/26; G03F7/40
Domestic Patent References:
JP2008158308A2008-07-10
Foreign References:
WO2006017035A12006-02-16
WO2005089150A22005-09-29
Attorney, Agent or Firm:
Johei Nakamura
Kimura Mitsuru
Taiji Morikawa