Title:
A high-fever conductivity resin-molding object and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6062579
Kind Code:
B2
Abstract:
The present invention provides a highly thermally conductive resin molded article that satisfies all demands of a high thermal conductivity, an insulation property, a low density, a mechanical strength, a high flowability of a thin-walled molded article, less abrasion on a die used for manufacturing, and high whiteness. The highly thermally conductive resin molded article at least includes (A) thermoplastic polyester resin, (B) platy talc particles, and (C) a fiber reinforcement, and (B) platy talc particle content falls within a range between 10% by volume and 60% by volume, where the entire composition is 100% by volume, a number average particle size of the platy talc particles falls within a range between 20 mum and 80 mum, and the (B) platy talc particles are oriented in a surface direction of the highly thermally conductive resin molded article.
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Inventors:
Soichi Uchida
Kazuaki Matsumoto
Masashi Sakaguchi
Yasushi Noda
Ujikata Shoji
Kazuaki Matsumoto
Masashi Sakaguchi
Yasushi Noda
Ujikata Shoji
Application Number:
JP2016001290A
Publication Date:
January 18, 2017
Filing Date:
January 06, 2016
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L67/02; B29C45/00; C08K3/22; C08K3/34; C08K3/38; C08K7/02
Domestic Patent References:
| JP2010138228A | ||||
| JP2009242455A | ||||
| JP2010065179A | ||||
| JP2009242456A |
Foreign References:
| WO2009116357A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark