Title:
A high-frequency-oscillation use electrolysis grinding method and its device
Document Type and Number:
Japanese Patent JP5935089
Kind Code:
B2
Abstract:
To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.
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Inventors:
Toru Tachibana
Satoshi Kobayashi
Takahashi Masayuki
Murakoshi Chika
Kazunori Koike
Satoshi Kobayashi
Takahashi Masayuki
Murakoshi Chika
Kazunori Koike
Application Number:
JP2012155396A
Publication Date:
June 15, 2016
Filing Date:
July 11, 2012
Export Citation:
Assignee:
Micron Precision Co., Ltd.
International Classes:
B23H7/38; B23H5/08; B24B1/04; B24D99/00
Domestic Patent References:
| JP3234451A | ||||
| JP3251317A |
Attorney, Agent or Firm:
Patent business corporation Protech
Tetsumu Tetsumu
Tetsumu Tetsumu