サンドイッチ構造を有する高硬度焼結体複合材料

Japanese Patent JPH06669

B2

A composite sintered material having a sandwich structure is composed of a hard layer of a sintered diamond compact sandwiched between a pair of substrates and is suitably used as a material for drill.The composite sintered material having a sandwich structure consists essentially of:a hard layer composed of sintered diamond compact;a pair of intermediate layers each having a thickness of 10 to 500 microns and bonded respectively to one of the opposite surfaces of said hard layer, each of said intermediate layers consisting of a material which has a thermal expansion coefficient of 3.0 x 10-⁶ to 6.0 x 10^-6/ °C and prevents the transfer of the iron group metal therethrough in the course of the sintering of the hard layer;a pair of substrates bonded respectively to one of the surfaces of said intermediate layers to form a sandwich construction with the hard layer and composed of a metal or alloy having a thermal expansion coefficient lower than 6.0x10^-6/°C.In case the composite sintered material is used as a blade tip for cutting tool, the sintered diamond compact contains preferably 5 to 15 vol% of an iron group metal and the balance being of diamond particles, and each of the substrates is composed of a sintered alloy mainly composed of WC and/or MoC having a thermal expansion coefficient lower than 4.6 x 10-⁶/ °C.

JP2008509822	Indexable cutting inserts and methods for manufacturing them
JP5845288	A drill and a method for manufacturing a machined product using it
JP6228184	Drill

HARA AKIO
YAMAMURA AKIHIKO

JP24592585A

January 05, 1994

November 01, 1985

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SUMITOMO ELECTRIC INDUSTRIES

B23B51/00; B22F7/00; B22F7/02; B22F7/06; B24D3/10; C04B37/02; C22C26/00; C22C29/08; C22C29/16; (IPC1-7): C04B37/02; B22F7/02; B23B51/00; C22C26/00; C22C29/08; C22C29/16

JPS5879881A
JPS5884188A

越場 隆

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