高分子化合物、レジスト材料及びパターン形成方法

Japanese Patent JP4235810

B2

A polymer comprising recurring units having a partial structure of formula (1) wherein R¹ is a single bond or alkylene or fluoroalkylene, R² and R³ are H or alkyl or fluoroalkyl, at least one of R² and R³ contains at least one fluorine atom is used as a base resin to formulate a resist composition which has advantages including high transparency to radiation having a wavelength of up to 200 nm, substrate adhesion, developer affinity and dry etching resistance.

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JP2831613	[Title of Invention] A composition based on dicyclopentenyloxyalkyl ester of (meth) acrylic acid and its use in the field of construction.
JP5287264	Radiation-sensitive resin composition

Yuji Harada
Jun Hatakeyama
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Haruhiko Komoriya
Kazuhiro Yamanaka

JP2003363134A

March 11, 2009

October 23, 2003

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Shin-Etsu Chemical Co., Ltd.
Panasonic Corporation
Central Glass Co., Ltd.

C08F220/28; C08G61/02; C08F16/26; C08F20/28; C08F32/08; C08F216/14; C08F220/24; C08F232/08; G03C1/10; G03C1/76; G03F7/004; G03F7/039; H01L21/027

JP2003192733A
JP2001302728A
JP2003015301A

Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa

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