Title:
ヒンジ装置及びそれを用いた超低温フリーザ
Document Type and Number:
Japanese Patent JP5535035
Kind Code:
B2
Abstract:
A hinge device features improved ease of installation/removal of covers thereof to/from mounting bases thereof. The hinge device, which has mounting bases (11,21) and knuckles (12,22), is connected such that it swings on a hinge pin (30) inserted in the knuckles. The covers (30,31) conceal mounting screws of the mounting bases. Each of the mounting bases (11,21) has recesses (19) formed in a side surface (11A,21A) on a non-supporting side, grooves (17,27) which are formed in a side surface (11B,21B) adjacent to both ends in the axial direction of the hinge pin (30) and which extend to a side surface, and an engaged portion concavely formed in each of the groove. The inner side of the cover has engaging portions (32,32) which are inserted in the groove (17,27) and which detachably engages with the engaged portion when the cover is installed, and also has protruding streaks (33) which enter into and engage with the recesses (19).
Inventors:
Yoshihiro Takahashi
Hashiba Tomokazu
Takayuki Arai
Hashiba Tomokazu
Takayuki Arai
Application Number:
JP2010243637A
Publication Date:
July 02, 2014
Filing Date:
October 29, 2010
Export Citation:
Assignee:
Panasonic Healthcare Co., Ltd.
International Classes:
E05D3/02; E05D5/04; F16B5/10; F16C11/04; F25D23/02
Domestic Patent References:
| JP10061306A | ||||
| JP2001237565A | ||||
| JP2005147650A | ||||
| JP2008157023A | ||||
| JP10121821A | ||||
| JP8210011A | ||||
| JP56108476A |
Attorney, Agent or Firm:
Kei Amekasa