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Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2600454
Kind Code:
B2
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Inventors:
Yuji Ando
Application Number:
JP19556590A
Publication Date:
April 16, 1997
Filing Date:
July 24, 1990
Export Citation:
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Assignee:
NEC
International Classes:
H01L29/68; H01L21/20; H01L21/338; H01L29/205; H01L29/778; H01L29/812; (IPC1-7): H01L29/68; H01L21/20; H01L21/338; H01L29/205; H01L29/778; H01L29/812
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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