Title:
電子デバイス用の絶縁ワイヤを備えたヒンジ
Document Type and Number:
Japanese Patent JP5193212
Kind Code:
B2
Abstract:
The combination of a hinge and an insulated wire is provided, wherein the hinge is capable of closing and opening to an angle of at least 90°, the insulated wire being secured by the hinge so as to fold when said hinge is closed and to unfold when said hinge is opened, the insulation on the wire comprising fluoropolymer, such as tetrafluoroethylene/-hexafluoropropylene copolymer or tetrafluoroethylene/perfluoro(methyl vinyl ether)/perfluoro(propyl vinyl ether) copolymer, each polymer having a melting point of 260 to 290° C. and MIT Flex Life of at least about 15,000 cycles, the hinge being useful in such electronic devices as a laptop computer or a clamshell cell phone, attaching the keyboard and screen portion to one another, the insulation being capable of repeated opening and closing of the hinge without cracking of the insulation.
Inventors:
Robert Dee Kenny
Philip S Smith
Patricia A Tree
Sundar Kirunagarh Venkatalarman
Philip S Smith
Patricia A Tree
Sundar Kirunagarh Venkatalarman
Application Number:
JP2009532383A
Publication Date:
May 08, 2013
Filing Date:
October 10, 2007
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01P11/00; H01B7/02; H01B7/04; H01B11/18; H04M1/02
Domestic Patent References:
| JP52109588A | ||||
| JP2005322462A | ||||
| JP62192411A |
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi
Chika Takagi
Noriyuki Takebayashi
Chika Takagi