Title:
A hollow package for solid-state image sensing devices, a solid-state image sensing device, and a solid imaging device
Document Type and Number:
Japanese Patent JP6184106
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a hollow package for a solid state image sensor which has a structure that can be mounted on a mounting substrate without being soldered and thereby prevents the deterioration of the connection strength of each connection part, the occurrence of cracks in a resin mold portion, and the deterioration of the sensitivity of the solid state image sensor.SOLUTION: A flexible printed circuit board 103 includes: a fixed part 103b which is laminated on a base plate 101 to be fixed thereto, the fixed part 103b where an inner lead 212 including a bonding pad 211 is drawn; and a protruding part 103a protruding from the base plate 101 to the exterior, the protruding part 103a where an outer lead 302 including a terminal part 301 is drawn. A frame part 104 is provided on the flexible printed circuit board 103.
Inventors:
Mitsuto Hitsuka
Application Number:
JP2013012210A
Publication Date:
August 23, 2017
Filing Date:
January 25, 2013
Export Citation:
Assignee:
Mtex Matsumura Corporation
International Classes:
H01L27/146; H01L23/02; H01L23/04; H01L23/08; H04N5/369; H04N5/372; H04N5/374
Domestic Patent References:
| JP8227984A | ||||
| JP2008504739A | ||||
| JP2003347446A | ||||
| JP2009128521A |
Foreign References:
| US6268231 |
Attorney, Agent or Firm:
Koichi Washida