Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2023074183
Kind Code:
A
Abstract:
To provide a hot-melt adhesive that causes less label falling even if stored at ultralow temperature and impact is given, and has high holding power at high temperature, less adhesive residue on a surface to be adhered when an adherend surface peels off, and furthermore has satisfactory adhesiveness and excellent alkali dispersibility.SOLUTION: A hot-melt adhesive contains specific styrene-based elastomer (A), rosin-based tackifier (B), process oil (C), specific wax (D) which is one or more selected from the group consisting of acrylic acid wax and maleic anhydride wax, specific polyethylene wax (E), and specific hydrogenated petroleum-based tackifier (F) severally by a specified amount.SELECTED DRAWING: Figure 1
Inventors:
OKUYAMA TOMOHIRO
Application Number:
JP2021187000A
Publication Date:
May 29, 2023
Filing Date:
November 17, 2021
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
TOYOCHEM CO LTD
TOYOCHEM CO LTD
International Classes:
C09J109/06
Domestic Patent References:
| JP2014024901A | 2014-02-06 | |||
| JP2014070099A | 2014-04-21 | |||
| JP2014089335A | 2014-05-15 | |||
| JP2014159563A | 2014-09-04 | |||
| JP2016060847A | 2016-04-25 | |||
| JP2021095443A | 2021-06-24 | |||
| JP2021095448A | 2021-06-24 |
Foreign References:
| WO2012147951A1 | 2012-11-01 |