Title:
HEAT MEDIUM, AND HOT WATER SUPPLY DEVICE OR HEAT EXCHANGE DEVICE USING HEAT MEDIUM
Document Type and Number:
Japanese Patent JP2017075740
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To develop/provide a new heat medium to supply hot water by putting the heat medium in a tank to exchange heat with water, or pouring water into a heat storage tank, and putting the heat medium in a heat exchanger to exchange heat with the water, and a hot water supply device or a heat exchange device using the heat medium.SOLUTION: Inorganic base is mixed with polyethylene glycol to prepare a heat medium X having conductivity higher than that of polyethylene glycol. An ionic liquid is mixed with polyethylene glycol to prepare a heat medium having conductivity higher than that of polyethylene glycol. In a hot water supply device, the heat medium is used, and water in a silicon hose 3 disposed in a tank is allowed to exchange heat by temperature rising arc generation heat in a heat medium temperature rising tank 1. In a hot water supply device, a heat medium temperature rising tank is disposed, and the heat medium is circulated in a silicon hose in the tank by a heat-resisting circulation pump 8, to heat the water in the tank to a high temperature to supply hot water. In a heat exchange device, a heat medium temperature rising tank is disposed, and water or a liquid is reheated by the heat medium in the tank by using a heat-resisting circulation pump so that the water or liquid has service temperature.SELECTED DRAWING: Figure 1
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Inventors:
SASAKI KAZUYA
Application Number:
JP2015203873A
Publication Date:
April 20, 2017
Filing Date:
October 15, 2015
Export Citation:
Assignee:
NIHON RISUIKEN CO LTD
International Classes:
F24H1/10; F24H1/16
Attorney, Agent or Firm:
Yasuo Mihara