Title:
The hot welding film which consists of a denaturation polyolefin system resin composition and it
Document Type and Number:
Japanese Patent JP6111128
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a modified polyolefin-based resin composition which has less tackiness at normal temperature and excellent handling properties and is excellent in adhesiveness with a hardly bondable adherend by simple heating, and to provide a hot melt adhesive film.SOLUTION: There is provided a modified polyolefin-based resin which comprises: 50 to 98 wt.% of a modified polyolefin resin (A) which is graft-modified using a monomer component including an ethylenic double bond and an epoxy group in a same molecule; and 2 to 50 wt.% of a polyolefin-based resin (B), where the modified polyolefin resin (A) has a melting point of 120°C or more and 150°C or less, the polyolefin-based resin (B) has a melting point of 80°C or more and 120°C or less and the heat of melting ΔH(B) of the polyolefin-based resin (B) is larger than the heat of melting ΔH(A) of the modified polyolefin-based resin (A), and there is provided a hot melt adhesive film composed thereof.
Inventors:
Ryoji Nakayama
Takeshi Sugiyama
Takeshi Sugiyama
Application Number:
JP2013086810A
Publication Date:
April 05, 2017
Filing Date:
April 17, 2013
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L51/06; C08F255/00; C08L23/06; C09J7/00; C09J123/00; C09J125/02; C09J151/06
Domestic Patent References:
| JP2014210841A | ||||
| JP2009126922A | ||||
| JP7258355A |
Attorney, Agent or Firm:
Atomi International Patent Office