Title:
Identifier providing device for computer equipment
Document Type and Number:
Japanese Patent JP6310945
Kind Code:
B2
Abstract:
To enable mass production of an identifier providing device with sufficiently high yield, even in case of forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 µm and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 µm or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or a aggregating/cohering state at the smallest thickness portion.
Inventors:
Masayuki Mori
Takashi Kondo
Susumu Takagishi
Takashi Kondo
Susumu Takagishi
Application Number:
JP2015555851A
Publication Date:
April 11, 2018
Filing Date:
December 30, 2013
Export Citation:
Assignee:
Gocco.
International Classes:
G06F3/02; G06K19/067
Domestic Patent References:
| JP2011134298A | ||||
| JP2013017590A | ||||
| JP2012230866A | ||||
| JP2012506080A | ||||
| JP2011216756A | ||||
| JP201165783A |
Foreign References:
| WO2012070593A1 |
Attorney, Agent or Firm:
Masayuki Manda