Title:
IMAGING MODULE AND IMAGING APPARATUS
Document Type and Number:
Japanese Patent JP2017200039
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an imaging module capable of reducing focus shift due to expansion and shrinkage of an adhesive.SOLUTION: An imaging module 110 includes: a substrate 2 on which an imaging device 5 is mounted and in which a through hole 20 is formed; a support pin 114 inserted so as to penetrate the through hole 20; a holding unit 113 that holds a lens 6 that forms a subject image on the imaging device 5; and an adhesive 4 provided in the through hole 20 and fixing the substrate 2 and the support pin 114. At least a tip portion 114a of the support pin 114 is tapered from the base of the pin toward the tip of the pin.SELECTED DRAWING: Figure 4
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Inventors:
OKAMURA MASAYUKI
YAMAGUCHI AKIHIRO
KUBOTA CHIEMI
SHINOHARA HIDENORI
TAKEUCHI KENICHI
YAMAGUCHI AKIHIRO
KUBOTA CHIEMI
SHINOHARA HIDENORI
TAKEUCHI KENICHI
Application Number:
JP2016089030A
Publication Date:
November 02, 2017
Filing Date:
April 27, 2016
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
H04N5/225; G02B7/02; G03B15/00; G03B17/02
Attorney, Agent or Firm:
Patent Business Corporation Sunnext International Patent Office
Fuyuki Nagai
Fuyuki Nagai
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