An implant sending device by which is attached to a catheter or interconnection is carried out to a catheter, an implant sending-out catheter, and a method

Title:

An implant sending device by which is attached to a catheter or interconnection is carried out to a catheter, an implant sending-out catheter, and a method

Document Type and Number:

Japanese Patent JP6039561

Kind Code:

B2

Inventors:

Getz, Wolfgang
Rim, hou-sen

Application Number:

JP2013528551A

Publication Date:

December 07, 2016

Filing Date:

September 14, 2011

Export Citation:

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Assignee:

Venus MedTech(HangZhou)Inc.

International Classes:

A61F2/95; A61F2/844

Domestic Patent References:

JP2009528089A
JP2009514594A
JP11509450A

Foreign References:

DE102008012113A1
US20070100427

Attorney, Agent or Firm:

Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Kei Sakurada
Mie Hideki

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