Title:
静電容量センサの改善
Document Type and Number:
Japanese Patent JP5795369
Kind Code:
B2
Abstract:
A sensor assembly includes a housing assembly, an electrode arrangement and a diaphragm having a fixed portion secured to the housing assembly and an active portion movable relative to the electrode arrangement in response to a differential pressure applied to opposite sides of the diaphragm. The fixed portion of the diaphragm is secured at one or more locations relative to at least a portion of the housing assembly; and at least one groove is formed in the fixed portion of the diaphragm between the locations at which the diaphragm is fixed relative to the housing assembly and the active portion so as to relieve any stress on the active portion of the diaphragm. A method of making the sensor assembly is also disclosed.
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Inventors:
Gurjein, Clichy
Application Number:
JP2013518464A
Publication Date:
October 14, 2015
Filing Date:
June 21, 2011
Export Citation:
Assignee:
MKS INSTRUMENTS,INCORPORATED
International Classes:
G01L13/00; G01L9/12; G01L13/06
Domestic Patent References:
| JP2008032451A | ||||
| JP60031645U | ||||
| JP60088247U | ||||
| JP2009258109A | ||||
| JP2009162751A | ||||
| JP3014443U | ||||
| JP5019934U | ||||
| JP11108783A | ||||
| JP62049743U | ||||
| JP10148593A | ||||
| JP2001267588A | ||||
| JP10332511A | ||||
| JP61176432U | ||||
| JP2095832U | ||||
| JP7128170A |
Foreign References:
| US20090266172 |
Attorney, Agent or Firm:
Hiroaki Sakai
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