Title:
【発明の名称】インダクタコイル構造体およびその製造方法
Document Type and Number:
Japanese Patent JP2003526902
Kind Code:
A
Abstract:
A high current, low profile inductor (IHLP) includes a conductive coil molded within an inductor body substantially free from ferrite materials and comprising powdered iron materials. The method comprises pressure molding the inductor body substantially free from ferrite materials and comprising a powdered magnetic material within the hollow core of the coil and completely around the coil so that the magnetic material is substantially free from voids therein without shorting out the coil.
Inventors:
Timothy M Shaffer
Application Number:
JP2000606022A
Publication Date:
September 09, 2003
Filing Date:
March 15, 2000
Export Citation:
Assignee:
Vishay Dale Electronics, Inc.
International Classes:
H01F37/00; H01F27/28; H01F41/04; H01F17/04; H01F27/29; (IPC1-7): H01F37/00
Domestic Patent References:
| JPH05291046A | 1993-11-05 | |||
| JPH04215412A | 1992-08-06 | |||
| JPH01266705A | 1989-10-24 | |||
| JPS61184806A | 1986-08-18 | |||
| JPS5395136U | 1978-08-03 | |||
| JPS52168221U | 1977-12-20 | |||
| JPH09120926A | 1997-05-06 | |||
| JPH09260126A | 1997-10-03 |
Attorney, Agent or Firm:
Shoichi Takezawa (2 outside)