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Title:
インダクタ装置及びその製造方法
Document Type and Number:
Japanese Patent JP6623028
Kind Code:
B2
Abstract:
An inductor device includes a first insulating layer having a first via hole, a first metal layer formed on an upper surface of the first insulating layer and having a droop portion at an upper end-side of the first via hole, a second metal layer formed on a lower surface of the first insulating layer and having a first connection part exposed to a bottom surface of the first via hole, and a first metal-plated layer formed in the first via hole and configured to connect the first connection part and the droop portion of the first metal layer.

Inventors:
Horikawa Taiai
Motoo Nakanishi
Tatsuaki Denda
Application Number:
JP2015210439A
Publication Date:
December 18, 2019
Filing Date:
October 27, 2015
Export Citation:
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Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01F17/00; H01F37/00; H05K1/11; H05K3/00; H05K3/40
Domestic Patent References:
JP61067293A
JP2005286122A
JP2002009434A
JP2007134364A
JP7176869A
JP201373994A
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito



 
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