Title:
POLYETHYLENE RESIN COMPOSITION AND INFLATION FILM AND HEAVY SUBSTANCE PACKAGING FILM MADE OF THE SAME
Document Type and Number:
Japanese Patent JP2017061654
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyethylene-based resin composition for a heavy substance packaging film, which has excellent molding processability and an excellent balance in mechanical characteristics and rigidity.SOLUTION: The polyethylene-based resin composition is to be used for molding a film having a film thickness of 60 μm or more, and comprises a specific linear ethylene α-olefin copolymer (A) by 31 to 99 wt.% and an ethylene α-olefin copolymer (B) satisfying the following conditions (B-1) to (B-5) by 1 to 69 wt.%. The conditions are: (B-1) a melt flow rate MFRof the copolymer is 0.1 g/10 minutes to 10 g/10 minutes; (B-2) a densityis 0.895 to 0.940 g/cm; (B-3) a molecular weight distribution (Mw/Mn)measured by gel permeation chromatography (GPC) is 3.0 to 5.5; (B-4) a minimum (gc) of a branch index g' in the molecular weight range from 100000 to 1000000 is 0.40 to 0.85; and (B-5) a (W+W) value measured by cross-fractionation chromatography (CFC) is over 40 wt.% and less than 56 wt.%.SELECTED DRAWING: None
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Inventors:
IWAMOCHI KOKEN
KODAMA KAZUFUMI
HAYASHI TAISHO
KODAMA KAZUFUMI
HAYASHI TAISHO
Application Number:
JP2015188934A
Publication Date:
March 30, 2017
Filing Date:
September 25, 2015
Export Citation:
Assignee:
JAPAN POLYETHYLENE CORP
International Classes:
C08L23/08; C08J5/18
Domestic Patent References:
JP2015021112A | 2015-02-02 | |||
JP2012214781A | 2012-11-08 |